From LiDAR for autonomous vehicles to Mini and MicroLED displays, to the number of cameras increasing exponentially around us, to massive data centers requiring faster optical communications—optoelectronic devices are the future. Just as electrical technology eclipsed mechanical in impact and importance in the 20thcentury, we will see optical eclipse electrical technology over the next 100 years. This continued progress brings new test challenges to ensure that optoelectronic devices are tested accurately, affordably, and quickly so that the latest display, car, camera, and data center enables new advances across our world.
One of the most notable test challenges occurs in testing optoelectronic devices at the semiconductor wafer and package level. Correlating and synchronizing both optical and electrical inputs and outputs is critical to producing high-quality optoelectronics quickly. At NI, we work with customers to test a variety of optoelectronic devices every day. While there are many differences in testing LEDs, optical transceivers, and laser diodes, these devices share a similar test challenge: how do we test both optical and electrical signals as quickly and efficiently as possible?